I'm currently working on an analysis for a 2U 19" rack based piece of equipment.
My main interest is in the airflow inside the equipment, there are a number of IC's that are generating heat , however I don't have the thermal properties of the IC's and it is proving difficult to get the data,
I know most manufacturers can supply this sort of info but what do you do if you can get it.?
Does anyone have details for generic IC's that I can use or can you point me in the direction of useful information sources ?
Any help would be appreciated
If interested is the air flow in the cabient , only the dissapation power of IC is the key property. You can treat IC just as simple cuboid with the conductivity of typical IC pacakge in the flotherm library. You can use Zoom-in methodology to do detail analysis for ICs in PCB, and you may need a detailed or compact model for IC. You can get it from IC vendors or create it via Mentor's Flopack web site which is fast and easy because most of IC vendors don't provide IC therml model.
Unfortunatly it is a little more complicated than that as the device has a different Theta-jc value for the top and bottom faces of the device due to the construction of the chip.
Also, as I mentioned, I am having problems getting the information from the manufacturer hence my post on the forum.
Also I am using the FloEFD.Pro package which doesn't have IC packages built in to the library
Thanks for your comments
As recommended, in FloEFD you can create cuboids with package domensions and material of "typical IC". Then assign volume power source to it and it would match the worst case of the real IC.
I performed a successful simulation with this approach for 1U 19'' equipment with fans. Certainly you'll be off for about 10% but it's almost always the case with thermal simulations (due to model and condition definitions).