I don't use the Advanced Packaging module, but I know there are some default scripts available for this. E.g. a 'BGA Wirebond Report.BAS.'
I think it will be a good idea for you to take a look in the 'PADS Layout Advanced Packaging Tutorial' (can be found in C:\MentorGraphics\PADSVX.2\docs\pdfdocs\padslayout_ap_tut.pdf).
The last section is describing how to create Wire Bond Reports.