I want to suppress the unused pads in the inner layer and only connected pads should be present. I remember it can be done by using padstack process. Could anyone share the procedure to do this?
I want to suppress the unused pads in the inner layer and only connected pads should be present. I remember it can be done by using padstack process. Could anyone share the procedure to do this?
I need full documentation with step by step procedure.
This is for the through-hole pin. I need for via.
RTFM,
This is for both pads and via's. No difference
I don't want to edit using the padstack editor. I want to edit only by using the padstack processor.
If you want to use this feature, you have to follow the rules.
When you do not build the padstacks as described in the manual, it will not work. It is that easy!
Please refer to the attached image. It will not work for via using the method you preferred. For via's it only works using padstack processor.
I just tried it, and it works lik a charm.
You must be doing something wrong.
On the layers that the via is not connected, there is only the hole.
which version you are using? Are you using VX? I am not using VX.
I am not getting (NC Pad) anywhere.
I am using VX2.1 and VX2.4. Maybe that explains the difference.
I am not using VX right now. If you have the procedure for the earlier version of VX share it.
The NC Pad method for vias became available in VX2.1, the older method is also still available, but it is a Global Post Process. The new process is Dynamic as you route the design.
Old Process
1. Select a Via
2. Edit > Modify > Padstack Processor
3.Set the Action to Delete, select the Internal Layers to process, Select the Pads to Process, Apply to all padstacks or Selected, Process pads
Before
After:
Good Luck,
Vern
Hi All,
While taking gerber you can remove the unused pads by checking the marked option. But not only for vias. It removes all the unused through holes and vias.
Regards,
Sajiv.
Try edit->modify->padstack processor
This could have the required functions you require.