Hi, I'm a newbie in PADs. Last couple of weaks I'm trying to design a board with two layers. I have a question regarding auto routing and copper pour. I'm gonna copper pour with GND for both top and bottom layers.
Which procedure will be good? Should I-
1. copper pour first and go for auto routing or
2. before going for copper pour I should do the auto rout
If I do the first procedure and "Varify Design" then I'm getting errors for GND connectivity. Errors are something-
Isolated subnets for: GND
*** subnet # 1
HATCH OUTLINE(91.24139,44.58755 L2) C14.2 C13.2
*** subnet # 2
HATCH OUTLINE(87.41409,49.16875 L2) U24.1 .... ..... ....etc.
Errors are showing in followng pic. How can I solve the problem? Kindly let me know please.
And I'm not getting any errors for second procedure after checking the "Varify Design". But I'm getting more connections and vias. I want to minimize these by using first procedure.