0 Replies Latest reply on May 5, 2008 2:26 PM by karen_chow

    System to Improve RET-OPC Production by Dynamic Design Coverage Using Sign-off Litho Simulator

    karen_chow

       

      There's a new paper that came out at SPIE called System to Improve RET-OPC Production by Dynamic Design Coverage Using Sign-off Litho Simulator. It's an article that talks aboiut allowing RET/OPC production systems to reach maturity faster through detailed collection of hotspots identified at the design stage. The advanced process technologies have well known yield loss due to the degradation of pattern fidelity, and this paper addresses this issue.

       

       

      http://spiedl.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=PSISDG00692500000169250X000001&idtype=cvips&gifs=yes

       

       

      It's written by Mark Simmons, Jean-Marie Brunet , and YK Kim (Mentor Graphics), and Seung-Weon Paek (Samsung).