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System to Improve RET-OPC Production by Dynamic Design Coverage Using Sign-off Litho Simulator

Question asked by karen_chow on May 5, 2008

 

There's a new paper that came out at SPIE called System to Improve RET-OPC Production by Dynamic Design Coverage Using Sign-off Litho Simulator. It's an article that talks aboiut allowing RET/OPC production systems to reach maturity faster through detailed collection of hotspots identified at the design stage. The advanced process technologies have well known yield loss due to the degradation of pattern fidelity, and this paper addresses this issue.

 

 

http://spiedl.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=PSISDG00692500000169250X000001&idtype=cvips&gifs=yes

 

 

It's written by Mark Simmons, Jean-Marie Brunet , and YK Kim (Mentor Graphics), and Seung-Weon Paek (Samsung).

 

 

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