Yes you can to that for one or all alike components. Select component in question and modify pad stack thermal connectivity as you see necessary. One you will save the changes, it will prompted you if you want to apply this change to this or all components. Assign Split/Mixed plane to a layer and once you will pour this layer thermals will be created based of the pad stack thermal information you have customized.
thank you for your help.
Now I'm able to control the connection style by the foloowing steps.
- Split / mixed plane layers must be used
- According nets must be assigned in the layer setup
- Only plane areas can be used
- The pad stacks for the according components must be modified
In my point of view it is very cumbersome to do this with Pads...
I don't think it is that hard. You only need to that for special thermal requirements. Everything else will be connected with default thermal settings.
if it gets complicated to handle the copper plains depends on the stuff one is doing.
In the past, I've developed a 16 channel power electronics for thermal control.
A lot of the high current tracks where build by polygons.
At the end, I've had more than 300 polygons.
With this project in mind, handling of the polygons can make a lot of work in Pads...