3D EM modeling of the vias is usually for high speed signals running at speeds above 3GHz. Those are in general point-to-point differential topologies and I can’t see many cases where someone would want to have three ports on a via. Could you provide an example, where you need this feature?
For arbitary via modeling, you can use Hyperlynx 3D EM(IE3D)~
Thanks for your reply.
How can we make a standard via which can connect a signal from the top layer to an inner layer ? But the via has to be extended ( i.e. via stub) to the bottom layer.
Again, I know very well that 3D EM modeling of the vias is usually for high speed signals running at speeds above 3GHz. But I would like to know in what way does it improve the accuracy? or....why is it prefered for high frequency simulation?
In hyperlynx, after placing the via in the schematic, when I right click , following options are available.
If I keep the connected layer = 2 and set the layer span from top to layer 3, then the via is connected from the top layer to the layer 3. i.e. it is not a standard via ( via from top to layer 3 and via stub from layer 3 to bottom layer).
If I want to make it as a normal standard via, then I have to assign the connected layers = 3. Layer span: Top to bottom.
after clicking the OK, 3 ports are visible in the via. The middle port can be connected to a txn line which is connected in any inner layer.
Is this the right way to make a standard via in hyperlynx linesim?
When I assign this way to make a standard via , I am not able to use the option " 3D EM modeling".
Please correct me and guide me.