there was no intention to move the components into each other, right?
We have placed in cell on opposite site placement outline with heigth 0,04mm. So that we cannot placed cell with through hole pins over cell (on opposite side) also with through hole pins on other side.
Hope thats help! Best regards!
Do you manually solder components?
There is no DRC to check this situation but custom script(Expeditionpcb Automation) can do such type of check are hilight it.
You should define a Placement Obstruct on one (or both) of the cells. The layer should be specified as Opposite Side.
If the cell is placed on the top side of the board, the placement obstruct will be on the bottom side of the board. If the cell is placed on the bottom side of the board, the placement obstruct will be on the top side of the board.
In either situation, the online hazard and the Batch DRC will flag this situation.
This is the very useful information from your side,from the message ,I understand that ,the placement obsturct need to be defined for all through hole components in single side to get a false alarm . In that case, does it comes the DRC if SMD component on bottom side placed under the Top connector with obstructed region...Is there any option to differentiate to skip for the SMD component from this checks?
Thanks and Regards
its the same problem in throw hole at tpo and smt on bottom
the obstract sould be only around the throw pads + soldering keepout
the same problem like in pressfit connectors where we sould place keepout in botom
dont expedition have some tool to deal with it?