my first thought was about signal integrity. Sometimes you wish to have the "usual" ground plane as far embracing the signal as you can. Probably increased noise immunity. What is your take on this?
I assume that nowadays the fabrication of the pcb does not have issues (sliver, acid traps, etc...), so why do you want to remove them?
I agree with Matija on shielding requirement.
There are couple of factors need to be considered -
Shielding area with respect to ground plane, in case of couple of pins it is must.
Balancing copper for proper heat distribution during plating processes on padstacks
Simply we cannot remove number of thermal ties its depend on Power characteristics of the pin - may reuqire more than 2
Please let us know any other reason than above any thing else demands to keep Plane Scallops/Peninsulas.
Both above cases based on nature of layout density, pin characteristic and board parameters.
Hence users may want to keep or may want to remove Plane Scallops/Peninsulas based on specifications.
Option to choose remove or keep is best solution.
In addition to that in case of keep option if some parametric conditions like - min - max clearance is appreciable.
Thanks for the information from Matija and Sanjay on this topic. I totally agree that any removal of Plane Scallops/Peninsulas should be optional. Also, I want to explain the two use cases I have heard on why this functionality is needed:
High Voltage Pins - This is a situation when a High Voltage Pin is within plane metal it should have no Scallops/Peninsulas around the pin. This is to reduce the possibility of arching between the scallop point and the pin. So the idea is to keep the plane metal around the High Voltage Pin as smooth as possible.
Manufacturing - I have been told that specific to manufacturing customers which to remove Scallops and Peninsulas. Interesting enough I have not been provided details to the specific manufacturing problem that would be caused. I suspect it's specific to solder bridging between exposed plane metal and neighboring pads where the scallop ends up exposed between pads. I think this is a corner case specific to users who are not using soldermask pads and build soldermask opens as shapes around rows of closely place pads. I really would like to hear what the community thinks about this use case.
Removal of Scappops/Penisulas is welcomed. At present, much of SIPs(self-intersectiing polygon) be generated and it causes
PCB fabs complains it when they read the gerber into thier CAM system.