Can you guide us about "Expedition Advanced Packaging EE7.9.5" (Technote MG585668)?
Release Highlights is only available documentat on supportnet at this point.Which does not have any functional information.
Expedition Advanced Packaging Bundle is a Superset of Expedition PCB that offer design support for:
The product has been available for many years underr part number 238868 but for administrative purposes, we had to make some license changes to this bundle and this had to be made by obsoleting the PN 238868 and release Expedition Adv Packaging Stn Bnd SW under a new part number: 259132 as a one to one replacement product with identical functionality.
This license change was just released and notified through the mentioned Tech Note.
Let me know if you have additional questions
It's only a package info file which make your installed 7.9.5 to use license feature for 3D wire-bond etc.
Thanks for detailed explanation!
(I thought it's enhancement to DxDesigner packager!)
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