I would like to make a solid copper pour on both the top and bottom layers of a two layer PCB. Both of the copper pours will be connected to a thermal net. The goal is to use the copper pours to disapate heat from the pcb. I made a copper pour outline on both of the layers, but when I try to flood them nothing happens. I cannot use a copper shape alone because the pcb has nets routed on both the top and bottom layers. Therfore, a copper pour must be used to avoid existing nets it is not intended to be connected to.
How can I get the outline to flood?
How can I make the flood solid (not hatched)?