I would like to make a solid copper pour on both the top and bottom layers of a two layer PCB. Both of the copper pours will be connected to a thermal net. The goal is to use the copper pours to disapate heat from the pcb. I made a copper pour outline on both of the layers, but when I try to flood them nothing happens. I cannot use a copper shape alone because the pcb has nets routed on both the top and bottom layers. Therfore, a copper pour must be used to avoid existing nets it is not intended to be connected to.
How can I get the outline to flood?
How can I make the flood solid (not hatched)?
Pours and planes must be associated with a net.
There must be a netlist item on the pour surface for it to flood.
A netlist item would include a component pad or a via that is connected to the net.
You may need to add a couple of 'dummy' single pin parts (a net must have at least one pin-pair) to establish the net - then you'd have something to associate the pour area to.