I want to place conductive shapes around smd component pads. I placed and assigned net. How do I add thermal connections(tibars) to smd pads instead of placing direct contact with conductive shape?
Instead of a conductive shape place a plane shape.
I use Mentor Expedition.
Use either Split/Mixed Plane or Copper Pour functions instead of a copper shape. Planes and Pours will adjust for copper clearances around opposing nets, shapes will not.
But unless you intend to do much hand soldering or rework, thermal connections for SMD parts are not needed.
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