Yes, there is a possibilty:
add "Timing_Location Die" in the IBIS file below the [Component] statement
[Manufacturer] Xilinx Inc.
That did the trick, thank you!
While researching the "Timing_location" keyword, I also came across the "Si_location" keyword. I tried playing around with it, but it didn't seem to change anything. A little surprising considering it is a signal integrity simulation.
The waveform when measured at the die is cleaner than measured at the pin. I updated the IBIS model per recommendation and got a better results.
My question is how do I find out if the IBIS model parameters are at the pin or the die?
Usually, you can find in the device datasheet in a note if the SI parameters apply to the pin or the die. In the past, the thresholds and timing were always specified at the pin, because that is where they could be measured in the lab. Now, with more simulation and faster signal edges, some vendors will specify requirements at the die where they make more sense.