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these are different things: ibis defines C_Comp and C_Pk.
C_Comp : "This is the silicon die capacitance and does not account for package capacitance. It is the capacitance seen when looking from the pad back into the buffer". C_Pk represents the package capacitance.
Cin and Cout from the datasheet represent the internal capacitance of an input/output. hope this helps. ibis doesn't define Cin Cout