0 Replies Latest reply on Aug 26, 2015 9:50 PM by alaguvar

    IC Package design using Wirebond




      How to connect the wire bond from the DIE to the Power/Ground rings in Xpedition Advanced Package design?

      Also is there any other option to route the wire bond based on nets.Eg: In one instance i want to wire bond route only for VSS then VDD.


      Please share your thoughts.