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IC Package design using Wirebond

Question asked by alaguvar on Aug 26, 2015

Hello,

 

How to connect the wire bond from the DIE to the Power/Ground rings in Xpedition Advanced Package design?

Also is there any other option to route the wire bond based on nets.Eg: In one instance i want to wire bond route only for VSS then VDD.

 

Please share your thoughts.

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