PI is hot now. I have watched there are many are evaluating embeded capacitive material such as 3M c-ply and Oak-MitsuiFaradFlex. We have evualated these material 2 years ago and fabed sample.It can provide additional PI advantage compare to normal thin core. but it's cost isn't feasible to widely adopt it. Most of PI may be dressed by a good design of Power filtering. I have seen many designer never carefully desing thier power dilivering rail and some of design have inherient prolem with thier wrong filtering topology. I think it's first step for PI to better use normal capacitors instead of using embedded capcitive material. Such tools as Hyperlynx PI will make design tradeoff easy and fast.