6 Replies Latest reply on Feb 26, 2009 4:57 PM by yu.yanfeng

    How to define customized pacakge groups in the Cell editor?

    yu.yanfeng

      Pre-defined cell types are coarse.

       

      IPC-7351 support 56 SMT componet families. I can't find where to define group names in  hte libary manager.Hope Expeditioncb Cell editor to support define customized type groups and this help to define a detail rule for package clearances checking.

       

      1. Ball Grid Array w/collapsing balls (BGAC)
      2. Ball Grid Array w/non-collapsing balls (BGAN)
      3. Aluminum Electrolytic Capacitors (CAPAE)
      4. Ceramic Flat Packs (CFP)
      5. Ceramic Quad Flat Packs (CQFP)
      6. Chip Non-polarized Capacitors (CAPC)
      7. Chip Polarized Capacitors (CAPCP)
      8. Wire Rectangular Capacitors (CAPWR)
      9. Chip Inductors (INDC)
      10. Chip Resistors (RESC)
      11. Chip LED’s (LEDC)
      12. 2-Sided Concave Chip Array Resistors (RESCAV)
      13. S-Version Convex Chip Array Resistors (RESCAXS)
      14. E-Version Convex Chip Array Resistors (RESCAXE)
      15. Flat Chip Array Resistors (RESCAF)
      16. 2-Sided Concave Chip Array Capacitors (CAPCAV)

      17. Flat Chip Array Capacitors (CAPCAF)
      18. 2-Sided Concave Chip Array Inductors (INDCAV)
      19. Flat Chip Array Inductors (INDCAF)
      20. 4-Sided Concave Chip Array Resistors (RESCAV)
      21. 4-Sided Concave Chip Array Capacitors (CAPCAV)
      22. Leadless Chip Carriers Pin 1 Center (LCC)
      23. Leadless Chip Carriers Pin 1 Side (LCCS)
      24. Land Grid Array (LGA)
      25. Metal Electrode Face Diode (DIOMELF)
      26. Metal Electrode Face Resistor (RESMELF)
      27. Capacitor Molded Non-polarized (CAPM)
      28. Capacitor Molded Polarized (CAPMP)
      29. Diode Molded (DIOM)
      30. Inductor Molded (INDM)
      31. Resistor Molded (RESM)
      32. Precision Inductor (INDP)
      33. Oscillators Corner Concave (OSCCC)
      34. Oscillators Side Concave (OSCSC)
      35. Oscillators J-Lead (OSCJ)
      36. Oscillators L-Bend (OSCL)
      37. Plastic Leaded Chip Carriers (PLCC)
      38. Quad Flat No-lead w/Thermal Pad (QFN)
      39. Quad Flat No-lead No Thermal Pad (QFN)
      40. Pullback Lead Quad Flat No-lead w/Thermal Pad (PQFN)
      41. Pullback Lead Quad Flat No-lead No Thermal Pad (PQFN)
      42. Quad Flat Pack Pin 1 Center (QFPC)
      43. Quad Flat Pack Pin 1 Side (QFP)
      44. Quad Flat Pack w/Thermal Pad (QFP)
      45. Small Outline Package (SOP)
      46. Small Outline Package w/Thermal Pad (SOP)
      47. Small Outline Diodes (SOD) 49. Small Outline No-lead w/Thermal Pad (SON)
      50. Small Outline No-lead No Thermal Pad (SON)
      51. Pullback Lead Small Outline No-lead w/Thermal (PSON)
      52. Pullback Lead Small Outline No-lead No Thermal (PSON)
      53. Small Outline Transistor (SOT23) 3, 5, 6 & 8 lead packages
      54. Small Outline Transistor (SOT223) 4, 5 & 6 lead packages
      55. Transistor Outlines (TO) 3 – 16 lead packages
      56. Chip Diodes (DIOC)

      48. Small Outline J-Lead (SOJ)