1 Reply Latest reply on Jan 18, 2017 3:01 AM by kbak

    how to export wire bond report in PADS Layout ?

    k.r.kabaleeswaran

      Hi everyone,

      Currently i am working on Multi chip module.I created Die but i could not  able to see the Die Pad.i can able to see the Die in 2D line.How to assign the those Die pad in CAM setting ??

      How to export Wire bond Details or reports in PADS Layout ??

       

       

        • 1. Re: how to export wire bond report in PADS Layout ?
          kbak

          Hi

          I don't use the Advanced Packaging module, but I know there are some default scripts available for this. E.g. a 'BGA Wirebond Report.BAS.'

          I think it will be a good idea for you to take a look in the 'PADS Layout Advanced Packaging Tutorial' (can be found in C:\MentorGraphics\PADSVX.2\docs\pdfdocs\padslayout_ap_tut.pdf).

          The last section is describing how to create Wire Bond Reports.

          Regards Klaus