i done multi chip model board.In this board,i used wire bond used.the following details i need to clarify
1.how to export the wire bond details report from die package because i need to send to Fab vendor ??
2.How to assign the substrate in Layout definition because i go through the document from that document,need to assign substrate for Die package but in PADS i could not see any option in layout side.
3. Die package are in 2D line. how to export that details ??
please clarify above doubt which is very helpful to me
Thanks and Regards,
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