Hi every one,
I am working in Multi chip module. I have to create DIE package as mention in below image file. but I could not find any option to assign two die for one bond pad (wire bond pad) as I mention in red color.(please compare the two image file.).How to assign as I mention in Image file .In big rectangle box ,I kept two bond pad over lap with each other.it is not a correct way .I need to set Two Die pad wire should be connect with one bond pad. How to set in PADS Layout .
I have the .CSV file for 1st and 2nd pins are AGND. i paste the snap shot for this location, i think tool will not support two Die pad number should be same.so in which i need to change the .CSV file. Kindly reply any one.
Thanks and Regards,