* This mosfet ic(BTS7008-2EPA) having single exposed pad for heat sink purpose
* The recommended footprint (Green mark) also having single copper pad
* The recommended stencil aperture is right side image (Red mark)
* You can do one copper pour [+VS] and connect it to Supply voltage.
* Check here attached image.
* If you are designing 2-Layer PCB then you can add via for connecting Top - Bottom layer for more thermal stability.