To find the worst case high strain areas on a board at ICT it is important to find the high testpoint density areas but also those areas which also have high component densities on the opposite side of the board. If the component density is too high there will not be access for the ICT pushers on the opposite side. Usually a 5mm diameter clear area is required for the pusher. i.e. high density tps bottomside with high density comp count topside. Does anyone know a way to do this?