Does anyone have any standard verbage for via fill and flatness for the fab notes?
@Dave – thanks for your post. I would like to move it to the appropriate product community for greater visibility by users. The Member Resources area is for general community questions, comments, and suggestions. Which product is this in reference to?
Flatness (bow and twist)
- Bow and twist shall be 0.75% or less, measured in accordance with IPC-TM-650, method 2.4.22
For via filling we have a " more or less" common note;
- (All) vias should be filled with non-conductive epoxy and capped with copper.
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