I am using VX.1.2 pads layout and am trying to have a solder mask that has thermal tented vias under the heat slug for helping for cooling. I didn't originally and the solder would just get sucked through the vias causing a pour connection to the thermal pad under the chip.
Thoughts on how this can be done? I tried the two suggestions in the help area in the program but neither worked. One said to create a new via labeled as "tented" and create and add a solder mask layer to it and have it pad style at 0. The other said to right click on the via and create an attribute cam.soldermask.adjust and make the value -0.7mm (Opposite of what the via was).
Any help would be great.