I am making a uncommon BGA socket, and I want the pad connect between top and bottom layer
so i am think on making a through hole pad but no fine hole (filled with copper)
how is the setting in PADS library?
what you are describing, seems more of a via (filled and capped) in pad.
If you have some copper from the top to the bottom, then you need a diameter to fill this via with copper. Alsoyou want the pad to have no visible holes, so this is a classic via filled and capped.
Tho do this in Layout, you deign a classic SMD pad, and in the settings allow via in pad. Then you put the via from top to bottom. And last when the board producer makes the board, ask for a via filled and capped. This may make your board slightly more expensive.
Hope this helps
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