Currently we are investigating a possible switch-over from BoardStation to Expedition Enterprise. One the items, for us (at this moment) a blocking issue, is panelization. In our products (Consumer Electronics) the board and panel are pretty much related to eachother.
Right now we have a customized way of working to import board and panel data (via IDF) from Pro-Engineer into BoardStation.
In "off-the-shelf" Expedition it seems to be impossible to import Panel data.
My questions are:
Is it still common-practise to have panelization in-house or is it in most cases done by the pcb supplier?
How is panelization communicated towards the pcb supplier? (Stackup, Reference system, Breaking slots, FR2/FR4/..., Tolerances,...)
What about the cost uplift leaving panelization up to the pcb supplier?
Is there automation available to make panel import possible?
Is there a way of working or automation available to map panel constraints to board level?
Thanks for the feedback,