We are using 2007.2 and will migrate to 2007.7. I have verified all releases of EE2007.X and see no huge improvment there. The only purpose I consider to migrate to newer release is the severe bugs in the current releases.
I would like to help clarify the value of moving to one of the new releases of the EE flow specific to Expedition and XtremePCB. We have continually worked to enhance the quality of each release as well as deliver a significant number of features that have been requested by customers. We have see many customers comment on improved productivity as they moved from 2007.2/.3 to 2007.5/.6.
Also, we have fixed a significant number of customer specific requests. Below is a chart showing the number of customer requests that have been resolved by release.
Finally, here is a summary of Expedition PCB and XtremePCB improvements since 2007.2. As you can see from this list, a significant number of enhancement have been made to Expedition and XtremePCB over the past year.
Automated BGA Fanout Generation
Improved Padstack Editor
“Allow cell overhang” property on Cells.
New Editor Control
Improved Measurement for Dynamic Planes
Dynamic DRC Visualization
Any Angle Multiplow with Curves
Pin/Gate Swapping with fanouts
Review Hazards display of Actual Clearance
Layer Specific Contours
Via Span control by Rule Area
Breakout Traces support for SMD Pads
Change Via Properties for multiple selected Vias
Vector Font Support
Persistent Trace/Via hangers
TPR: Mutual BGA Escapes
XtremePCB: 12 new commands
Improved DiffPair Routing
Improve Anchor Points
Route from Plane
Routing from Hangers
Improved Performance for Negative Planes Generation
Automated BGA Breakout
Xtreme: CMC support for Multiple Circuits
Display Control Patterns on Constrained nets
Schematic Driven Footprints
Review Hazards Accept / Unaccept violations
Plow Any Angle Locking
Native Tuning with Arc
Tuning Miter Ratio Control
Dynamove DiffPairs at Any Angle
Parallelism Minimum Segment Length Control
Forward and Backward Annotation Reports
Improved Drawing Cells
XtremePCB: Replace Cell
XtremePCB: Padstack Processor
Automatic Pad Growing
Cell Technology Placement Rules
Draw Move Multiple Handles
Dynamic Planes removing of Scallops option
Plane Shapes Via Only Obstruct option
Plane Obstructs (All) layer option
Conductive Shapes <mouse select> net assignment
RF Productivity Improvements
RF Group Deletion
Enhanced Meander Edits
Advanced Packaging Improvements
Display Control Layer Name display
Automation support for Via Span creation
Via Span layer range display
Enhanced Cavity Placement
Cell support for Multiple Glue Spots
Placement Rules support for End to Side Package Clearance
Move Cell Text Command
Text Output Optimization
Multiplow form Trace Hangers within Reuse Circuits
Automatic connection between hangers within Reuse Circuits
Maintain connections when moving Reuse Circuits
Automatic Netload of Reuse Circuit pass through traces
CMC enabling of Net0 during Instantiation
Improved total Memory Consumption
Improved load performance
Details on each of these improvements can be seen within each releases What’s New & Cool as well as the release notes.
Expedition/XtremePCB Product Marketing Manager
ReleaseData.jpg 33.7 KB
What happened to the release of 2007.7?
Is it going to make September-Oct? BSD schedules indicated Aug 31st.
2007.8 was supposed to be Nov.
Our situation is this: (We are DC/EXP 2007.3)
We typically review all mentor releases before global rollout and most SR defects have been labeled as fixed in 2007.7.
We would normally want to wait for the .7 release because of the additional patches &features since the 6 release.
If this is going to slip even more we need to know because we dont want to release 6, uninstall 200 users+ the server and do it all over again later when 7 is released a few days later.
The major problem is the updates are not really patch releases but full (reinstallations)
I would love to know the following:
- Was the delay in rollout because of a serious discovery in QA or just a simple issue like CD masters, late code release etc.?
- Should I rollout .6 because .7 is completely unknown on the release date and it might slip out to oct/nov?
I understand delays and QA formalities but we are completely in the dark about the actual release 7 schedule and if we should release 6.
We are getting pressure and complaints from management @ patches and releases because instead of back patching versions; mentor is stating
fixed in the next release whenever its released.
You can contact me directly
We understand how critical implementations of new releases can be. That's why we created the 'PCB Planned Releases' page on SupportNet.
You must have missed our most recent update to the page though. EE2007.7 is scheduled for release later this month, so if you can wait another two weeks or so, you should be all set.
Achieving a quality release is of paramount importance to all of us. "Fixed in the next release" really is coming soon.