I have problems getting stitching vias without thermals while keeping thermals for component pins.
I got around this by setting pad sizes for via to 0 and got a good prototype, but I am not sure if this is going to be consisten from vendor to vendor. Anyway, with pad size 0 I always get bunch of warnings during connectivity verification, so I guess that just not the way to go.
I also tried setting "flood over" in options > thermals, but that kills thermals for component pins.
Help is appreciated.
You can do this by RMB the copper shape.
Select Properties and Options.
In this dialog you can enable "Flood over vias".