When we are migratingt to Rohs, PCB delamination problem get serious,more PCB delamination occure after Reflow Soldering
We know this problem have multiple aspects,material, refflow tempertures etc. Do we have a balanced solution?
What material are you using?
Does the delamination look like little blisters or larger areas?
Higher soldering temperatures increase water vapor pressure, so you may have to look at moisture content of your boards.