1 Reply Latest reply on Jan 21, 2011 5:25 AM by strangd

    Multiple Through Hole VIA's


      I'm new to Expedition so this might seem dumb.

      How can you have more than one size via spaning the stack up? I need micro via's for BGAs and other sizes fro routing / thermal transfer etc.

      I get error messages saying the via stak up is already used even though the hole and pads are dirrerent.



        • 1. Re: Multiple Through Hole VIA's

          Open CES and create a new rule set under Schemes.  Open the new scheme and under Via Assignments you will see a block containing a "..." button and (default).  Click the "..." button and pick a new via.  In your board layout place a Rule Area shape around your BGA and attach the new scheme to it.  When you are routing inside that Rule Area shape, you should get the new via.  You may also want to set different clearence rules for traces, pads and vias that are within that shape.