I am simulating a bus with IBIS models, none of which have the Timing_location keyword. The HL8.0 Help file indicates that pin-location is selected if the Timing_location keyword is not present. Simulation results are dramatically different between the pin and die locations. My models have what look like realistic values for package parastics (R_pkg, C_pkg and L_pkg) and pad capacitance (C_comp) parameters.
Under what cases is pin location recommended versus die? Strictly when trying to correlate simulations with physical probing? In this case, pin-level probing has gross (unacceptable) non-monotonicity compared to die-level probing for a simple point-to-point topology. I'd like to better understand in advance of physical prototyping. Thanks very much!