How can a thermal relief and the anti-pad be created for a surface mount pad in the top and the opposite side layer of the pastack?
Antipad are used for thru hole(s) or via(s) only.
Use Pad style and and define the size.
varora wrote: Anupama,Antipad are used for thru hole(s) or via(s) only.Use Pad style and and define the size. Vinay
But the anti-pad layeris only for the inner and the soldermask,paste mask layers.Will this go ?What shall be done to use a thermal relief and the anti pad on the mounted side and the oppsite side layers of the thru hole padstacks and vias??
Anti-pads are for the Inner layers only!
There is no need of Anti-pad for the mounted and opposite side.
You can add thermal relief in the Pad stack or go with the default.
You can define top or bottom layer as Split/Mixed plane and control Thermal Connectivity to through hole pad and via using the Pad Stack characteristics.
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