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question about package substrate simulation using Hyperlynx

Question asked by bchoi on Jun 11, 2012
Latest reply on Jun 12, 2012 by weston_beal



I have difficulty performing a simulation  on  an  IC  BGA package substrate.


The file format is mcm, and I import the file at Hyperlynx after changing  from an mcm format  to  an brd format.

I just have an IBIS mode of the package, then it is assigned to balls (I/O) using the IBIS, but In Hyperlynx, it shows die that is connected to the balls,so I do not know how to deal with the die in the simulation.