bchoi

Co Simulation (Chip Die and Package and PCB board)

Discussion created by bchoi on Jul 19, 2012
Latest reply on Dec 7, 2012 by kirk.fabbri

Hello,

 

Is it possible to perform the co simulation ( Chip Die and Package and PCB board) with HyperLynx?

 

If not possible,  what if uisng s-parameters extracted from the package  and PC board?

 

 

Thanks.

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