Recently I found the option in the SI Oscilloscope to probe at the die instead of the pin. (I believe it is an available option because I am using IBIS models for my driver/receivers). I think this is a better place to make the measurement because it is more representative of what the receiving circuitry will see. I would like to run batch simulations measuring at the die, because when I manually checked the waveforms some signal paths that failed when measured at the pin, would have passed if measured at the die.
Is there a way to tell the batch SI simulation tool to probe at the die?