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copper not flood in between two vias?? How to maintain copper width 3.6mil in b/w vias ?

Question asked by k.r.kabaleeswaran on Feb 12, 2018
Latest reply on Feb 16, 2018 by k.r.kabaleeswaran

Dear Team,

          i am working in BGA Component,BGA pitch is 0.65mm.BGA fantout is Via in Pad.in my design, i need to maintain copper widht is 3.6mil for plane layer under the BGA area.here i post the image file. Drill to drill need to maintain 7mil;  trace to via clearance is 4mil;if 3.6mil running in between  i can able to meet below image rules.but i need to assign the these rules for copper.if i flood the copper in under BGA area for below image rules copper is  not flood between 2 holes or 2 vias.

 

contraint rules attached below

 

if i set the above rules copper to copper disconnected happened in between 2 holes or 2 vias.

The following queries are aries below.

1.why copper disconnected happen in inner layer.

2.is PADS software is not allowed below 5 mil copper widht ??

 

kindly update any one.it is very critical. Need to solve it ??

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