I want to add thermal spokes around the via's in my PCB design, but unable to find the settings for this. Kindly share steps for the same.
Also share some examples for the thermal analysis, how its done.
First step would be to setup your thermal ties within the plane class assignments.
Second allocate that plane class to the plane
and then the vias will have thermal ties to their planes.
Attached is picture which hopefully explains in a bit more detail the process required.
I am unable to find these options in my PADS VX.1.1. Is these options available in PADS VX 1.1
sorry I am using expedition, so my answer referred to this.
I don't know PADS - therefore it is quiet possible that this feature is either not available or implemented in a different way.
Do you want to do this globally for all vias of that specific type?
If not, you may need to create a special via for the instances where you want to do this.
Are you using S/M planes?
If so, select the plane outline shape (SPO). Then change the properties of it under "Flood & Hatch Options", deselecting the "Flood over vias" checkbox.
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