Hi,
I need to add microvias of 50um diameter with drill size of 47um for 0.4mm pitch BGA package routing. So far i am unable to find options in PADS layout to put such small microvias. I tried to define microvias of 50um dimensions using
Setup>Pad stack>Pad stack type>Via
The probelm is that the software does not accept such small via dimensions. When i put via diameter of 2mil and drill size of 1.85mil, software starts complaining that your drill size is more than via size..:/
Can anybody help. Screenshot is attached
In the Tools>Options dialog look at the Design tab and check the drill oversize setting. You may need to 'temper' your drill size based on the oversize setting. I seriously doubt that you need or can achieve a 50u hole diameter ever with a laser uVia. Personally, I'd set the uVia pad diameter to be the same as the solder pad for the BGA and downsize the drill from there. I would advise engaging in a dialog with your fabricator to establish their capabilities and recommendations for your uVia.