I am talking about a multi-layer pcb design that is an example project in PADS Preview and reference documented as "PADS layout tutorial - SGI - PCB Design"(see attachment)
Related document has instructions, but not much design step figures are given.
1. Could you kindly tell me, for what angles this kind of design is more appropriate ?
2. For the case of manufacturing, what things we need to keep in mind?
3. Dont you agree GND, PWR need different layers?
4. Are you agree to use SMD type component other than through whole ?
Let me know please and treat me as a newcomer.