0 Replies Latest reply on Jun 5, 2017 12:07 PM by Ryan_Kasnick

    Mentor launches unique, end-to-end Xpedition High-Density Advanced Packaging flow


      It's here! Mentor has launched the Xpedition® High-Density Advanced Packaging (HDAP) flow; the industry’s first comprehensive solution for the design and verification of today’s leading-edge IC package designs. http://bit.ly/2svUHfg