Ryan_Kasnick

Mentor launches unique, end-to-end Xpedition High-Density Advanced Packaging flow

Discussion created by Ryan_Kasnick on Jun 5, 2017

It's here! Mentor has launched the Xpedition® High-Density Advanced Packaging (HDAP) flow; the industry’s first comprehensive solution for the design and verification of today’s leading-edge IC package designs. http://bit.ly/2svUHfg

 

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