It's easy to use S-parameters for package models in LineSim, but not in BoardSim. It's easy to use S-parameters for connectors in BoardSim Multi-board, but not for packages. You have two options: 1. use the package definition in the IBIS file and make it as close as possible to the S-parameter data. 2. make a small fake board to include just the controller IC. Then use the S-parameter model as the connector between this small fake board and the main board. This method is outlined in an application note - http://supportnet.mentor.com/reference/appnotes/index.cfm?id=5612
Thanks. Here are my comments about the two options you recommended:
1) "use the package definition in the IBIS file and make it as close as possible to the S-parameter data"
As you know, Ibis uses [Package Model] keyword to include R, L, C sparse matrices/distributed package model. How do you make those RLC matrices from an existing S-parameter file?
2) "make a small fake board to include just the controller IC. Then use the S-parameter model as the connector between this small fake board and the main board"
I implemented this in last week. The problem is that with this type of implementation, we have 3 boards; the fake board containing controller IC, original board containg routing up to DIMM connectors, and then momory modules cards connected at DIMM slots. With these 3 boards in a multiboard project, I did not get the paired signal names in DDRx batch simulation setup.
For the package model method, you can use a program that optimizes parameters. Create a circuit with Rpkg, Lpkg and Cpkg each with an optimization target value. Then set your optimizer to match the S12 of this circuit to the given S-parameters up to the frequency of importance for your DDR bus.
For the fake board method, the problem is that the DDR wizard shows the net names of the physical net connected to the controller device. In this case the net names are probably nonsense. I have a utility that will rename the nets in the fake board so that it makes more sense in the DDR wizard. Send me an email at firstname.lastname@example.org and I will email you the utility, if you like.
Starting in HyperLynx 9.0, the fake board methodology to include the package model is no longer needed. This AppNote http://supportnet.mentor.com/reference/appnotes/index.cfm?id=5612 is now obselete and has been taken off the SupportNet.
It now supports [External Circuit] as described in the following TechNote to include the package model in the BoardSim simulation.
This TechNote shows how to set it up if you have SPICE package model.
If you have an s-parameter model as the package, use the TechNote below in conjunction with the above TecNote. The TechNote below is about series passives but using the concept is the same.